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TEM-LOG-FIB-CU-5

EM-Tec FIB lift-out grids, Cu, 5 posts

Product Description
Copper EM-Tec FIB lift out grids, available with either 2, 3 or 5 posts. 5 post FIB lift-out grid - post size 70x190µm, use for attaching many TEM lamellas. Thickness is 30-40µm. Packaging size is vial/100.
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